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  lite - on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886 - 2 - 2222 - 6181 fax: 886 - 2 - 2221 - 1948 / 886 - 2 - 2221 - 0660 h ttp://www.liteon.com/opto smd led product data sheet l t pa - s38fum we spec n o. created date: 201 6 / 09 / 30 revision: (preliminary) C 1 . 2 bns - od - fc001/a 4 a 4
1 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) smd led ltpa - s38fum we rev description by date 1.0 new data sheet thomas 05 / 30 / 201 6 1. 1 update 3.1 thomas 09 / 30/ 201 6 1.2 u pdate 1200ma for 5.4,5.5,5.6,5.7 thomas 1 0 / 20 / 201 6 above data for pd and customer tracking only customer name: customer signature : print name : liteon sales signature: print name:
2 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 1. description s3838 is a new small size high flux led for slim designs. the black packag e stands for high stability. 1 . 1 features ? meet rohs . ? smd ceramic package. ? package in 16 mm tape on 7" diameter reels ? preconditioning: accelerate to jedec level 2 ? eia std package ? i.c. compatible ? compatible with automatic placement equipment ? compatible with infrared reflow solder process 1 . 2 applications ? aftermarket :accessary application 2 . package dimensions part no. lens color source color lt pa - s38 fumwe yellow ingan white 1. all dimensions are in millimeters and dimension tolerance s are 0.3mm . 2. dimensions without tolerances are for reference only.
3 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) notes : 1. esd spec is reference to aec - q101 - 001 hbm. 2. the unit of rth is c/w electrical and driving current is 700ma . 3. the package leds are not designed to be driven in reverse bias . 3. rating and characteristics 3 . 1 absolute maximum ratings at ta=25 c parameter symbol rating unit power dissipation p o 6 w m in dc forward current i f 50 ma m ax dc forward current i f 1, 2 00 ma peak plus current (1/10 0 duty cycle, 0.1ms pules width) i p 2,000 ma esd sensitivity (hbm) v hbm 8 kv junction temperature t j 1 50 c operating temperature range t opr - 40 c ~+ 125 c c storage temperature range t stg - 40 c ~+ 125 c c
4 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) notes 1. all of the vf value are typical and the real bin range please ref er vf binn ing parameter. 2. all of the flux value are typical and the real bin range please refer flux binning parameter. 3. tolerance of flux is 10 %, tolerance of vf is 5 %, and tolerance of cri is 3 . 4. thermal resistance measurement tolerance is 10% ,and with 11x 9 cm heat sink. 5. rever se voltage(vr) condition is applied to ir test only. the device is not designed for reverse operation 3 . 2 electrical / optical characteristics at ta=25 c parameter symbol values unit test condition min typ. max correlated color temperature cct -- 6 0 00 -- k i f = 70 0ma color rendering index cri -- 70 -- - viewing angle 2 1/2 -- 1 20 -- deg forward voltage v f 2.75 3.25 3.75 v luminous flux v 180 280 lm thermal resistance, junction - solder r th , j - s 5.5 c / w
5 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 4 . bin rank batch description on label: vf / i v / color ( ex. 8g/ 6n /5 7 ) 4.1 vf binning parameter; forward voltage unit : v @ 700 ma bin code min. max. 8e 2.75 3.00 8f 3.00 3.25 8g 3.25 3.50 8h 3.50 3.75 tolerance on each voltage bin is +/ - 0.1v 4.2 flux binning parameter; luminous flux un it : lm @ 700 ma bin code min. max. 5 m 180 201 6m 201 224 7m 224 250 8 m 250 280 toleranc e on each intensity bin is +/ - 1 0 %
6 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 4.3 color rank color bin table test @ 700 ma bin code color bin limits bin code color bin limits cie - point1 point2 point3 point4 cie - point1 point2 point3 point4 55 x 0. 3241 0. 3248 0. 3350 0. 3355 5 7 x 0. 3190 0. 3203 0. 3298 0. 3299 y 0. 3534 0. 3370 0. 3460 0. 3633 y 0. 3430 0. 3274 0. 3526 0. 3361 6 0 x 0.3145 0.3163 0.3246 0.3253 65 x 0.3104 0.3127 0.3199 0.3212 y 0.3330 0.3181 0.3424 0.3266 y 0.3234 0.3093 0.3325 0.3175 tolerance on each hue bin (x, y) bin is +/ - 0.01. 4.4 chromaticity coordinate
7 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 5 . typical electrical / optical characteristics curves . 5.1 r elative spectral power distribution at 700ma , 25c ambient temperature 5.2 radiation characteristics
8 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 5.3 maximum forward current vs. ambient temperature 5.4 forward current vs. forward voltage at 25 c
9 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 5.5 relative cie - x v.s. forward current at 25 c 5.6 relative cie - y v.s. forward current at 25 c
10 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 5.7 relative flux vs. current
11 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 6 . reflow soldering characteri stics profile feature lead free assembly average ramp - up rate (t smax to t p ) 3c / second max preheat temperature min (t smin ) 150c preheat temperature max (t smax ) 200c preheat time (t smin to t smax ) 60 C 180 seconds time maintained above tempera ture (t l ) 217c time maintained above time (t l ) 80 C 1 0 0 seconds peak / classification temperature (t p ) 2 60 c time within 5c of actual peak temperature (t p ) 5 seconds ramp C down rate 6c / second max time 25c to peak temperature 8 minutes max note s 1. the leds can be soldered using the reflow soldering or hand soldering method. the recommended hand soldering condition is 350c max. and 2secs max. for one time only, and the recommended reflow soldering condition is 260c max. and 5secs max. for three t imes max. 2. all temperatures refer to topside of the package, measured on the package body surface. the soldering profile could be further referred to different soldering grease material characteristic. the grease vendor will provide this information.
12 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 7. pa ckage dimensions of tape and reel 8. recommend soldering pad layout
13 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 9. c autions 9 .1 an led is a current - operated device. in order to ensure intensity uniformity on multiple leds co nnected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit below. circuit model a circuit model b (a) recommended circuit. (b) the brigh tness of each led might appear different due to the differences in the i - v characteristics of those leds. 9 .2 do not put any pressure on the light emitting surface either by finger or any hand tool and do not stack the cob products. stress or pressure may cause damage to the wires of the led array. 9 .3 this product is not designed for the use under any of the following conditions, please confirm the performance and reliability are well enough if you use it under any of the following conditions ? do not use s ulfur - containing materials in commercial products including the materials such as seals and adhesives that may contain sulfur. ? do not put this product in a place with a lot of moisture (over 85% relative humidity), dew condensation, briny air, and corrosi ve gas (cl, h2s, nh3, so2, nox, etc.), exposure to a corrosive environment may affect silver plating. 9.4 esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: use of a conductive wrist band or anti - electrostatic glove when handling these leds. all devices, equipment, and machinery must be properly grounded. work tables, storage racks, etc. should be properly grounded. use ion blower to neutralize the static charge which might have built up o n surface of the leds plastic lens as a result of friction between leds during storage and handling. esd - damaged leds will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or no light up at low currents. to ver ify for esd damage, check for light up and vf of the suspect leds at low currents. led led
14 / 1 4 part no. : lt pa - s38fumwe bns - od - fc002/a4 smd led lt pa - s38fum we (preliminary) 9.5 storage this product is qualified as moisture sensitive level 2 per jedec j - std - 020 precaution when handing this moisture sensitive product is important to ensure the reliability of the product. the package is sealed: the leds should be stored at 30c or less and 90%rh or less. and the leds are limited to use within one year, while the leds is packed in moisture - proof package with the desiccants inside. the package is opened: the storage ambient for the leds should not exceed 30c temperature or 60% relative humidity. it is recommended that leds out of their original packaging are ir - reflowed within one year . for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. leds stored out of their original packaging for more than one year should be baked at about 60 deg c for at least 2 0 hours before solder assembly.


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